Circular Type Magnetron Sputtering & Arc Ion Plating : Target Material – Various Metal(Cr, Ti, Al, Cu etc.) : Dimension : 4" Target Sputter Source 11sets / 4" Target Arc source 7sets
Rectangular Type Ion Beam Source : DC(5KW)
High Vacuum Pumping System(Rotary + Booster + Diffusion Pump)
Ultimate Pressure : Process Chamber 5 x 10-6 Torr within 3min
Heating Temperature : Max. 350°C
Jig Rotation(Independently RPM Control of Rotation and Revolution) : AC motor control with inverter : Roller & Shaft inside Chamber : RPM control Available(RPM : 5~30) : Jig isolation module for Bias
Power Processing
Full Automation Control System Using PC or PLC Based Touch Panel(Optional Item)