Standard Asher. RIE System

Model Number

ARS 5000 Series

Features

- Reactive Ion etching(RIE) is an etching technology used in micro fabrication.
- It uses chemically reactive plasma to remove material deposited on wafers.
- High0energy ions from the plasma attack the wafer surface and react with it.

Application

• Silicon etching
• Dielectrics etching(SiO2, Si3N4, etc)
• Polyamide etching

Specifications

• Substrate Size : Piece to 6inch
• Max. Temperature : 700°C (On Heater)
• Process Gases Nozzle & RF Plasma Source Effective Area : 6inch
• RF Power Supply : 13.56MHz, 600W
• Gas Flow System
  -Flow Control Range : 0~100 scum
  -Gas : Ar, O2, SF6, CHF3(4Channel + Option)
  -Gas Panel in Jungle Box
• All System Control using PLC Based Touch Panel(TFT 256Color)
• Ultimate Pressure : <1 x 10^-6 Torre within 10 min.